型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
---|---|---|---|---|---|---|---|---|
W25Q64FWIM | 其他被动元件 |
WINBOND/华邦 |
WSON8 |
16 |
3701 |
|||
MT29C4G48MAZBAAKS-5WT | 内存芯片 |
MICRON/美光 |
BGA |
13 |
1500 |
|||
KMFN60012M-B214 | 存储IC |
SAMSUNG/三星 |
BGA |
1913 |
850 |
|||
EMMC08G-M325 | KINGSTON/金士顿 |
BGA |
1647 |
799 |
||||
EMMC32G-V100 | KINGSTON/金士顿 |
BGA |
1513 |
33 |
||||
W25Q128FWPM | 内存芯片 |
WINBOND/华邦 |
WSON8 |
1522 |
1348 |
|||
AP7105-R95MOG | 其他被动元件 |
AIROHA |
QFN |
15 |
7925 |
|||
TFA9890AUK/N1 | NXP/恩智浦 |
BGA |
1621 |
1867 |
||||
KMF820012M-B305 | 存储IC |
SAMSUNG/三星 |
BGA |
1607 |
620 |
|||
EMMC16G-M525 | KINGSTON/金士顿 |
BGA |
1634 |
2204 |
||||
SKY77652-11 | 其他IC |
SKYWORKS/思佳讯 |
QFN |
1829 |
3786 |
|||
SKY77651-21 | 逻辑IC |
SKYWORKS/思佳讯 |
QFN |
1825 |
7588 |
|||
KMFNX0012M-B214 | 存储IC |
SAMSUNG/三星 |
BGA |
1731 |
100 |
|||
08EMCP04-NL2DT228 | KINGSTON/金士顿 |
BGA |
1637 |
695 |
||||
WTR-1605L-0-142WLNSP-TR-01-1 | QUALCO |
BGA |
15 |
827 |
||||
WCN-3680-0-79BWLNSP-SR-03-1 | QUALCO |
BGA |
12 |
5000 |
||||
TPS65856ZQZR | TI/德州仪器 |
BGA |
12 |
13500 |
||||
TPS65854ZQZR | TI/德州仪器 |
BGA |
12 |
2500 |
||||
THGBMHG8C2LBAIL | 存储IC |
TOSHIBA/东芝 |
BGA |
1834 |
687 |
|||
THGBMBG5D1KBAIL | TOSHIBA/东芝 |
BGA |
1625 |
40 |
商家默认展示20条库存